Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today that it has received multiple orders of its VertaCure PLP systems for advanced packaging from a leading semiconductor manufacturer in Japan. These systems will be utilized in the manufacturing of AI and HPC solutions, where they will support 2.5D/3D packaging. YES products have a long history of demonstrating superior quality of curing, coating and annealing for both R&D environments and high volume manufacturing flows.