04/16/2025 00:00
Black Hat Asia 2025 Announces Successful Close to Cybersecurity Event in Singapore

Black Hat, the cybersecurity industry’s most established and in-depth security event series, today announced the successful completion of Black Hat Asia 2025. The event welcomed more than 3,100 unique attendees joining in-person from April 1 to April 4 at the Marina Bay Sands Expo & Convention Centre in Singapore. Security professionals from 83 countries registered to attend the event and experience firsthand the latest in cybersecurity research, developments, and trends through 43 Briefin...

04/16/2025 00:00
VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables

VeriSilicon (688521.SH) today announced the launch of GCNano3DVG, a new ultra-low power graphics processing unit (GPU) IP designed specifically for wearable and other compact, battery-powered devices requiring dynamic graphics rendering. Featuring both 3D and 2.5D graphics rendering capabilities, GCNano3DVG delivers an optimal balance between visual performance and power efficiency, making it ideal for a wide range of applications including smartwatches, smart bracelets, and AI/AR glasses. Ver...

04/16/2025 00:01
NIPPON KINZOKU Co-Creating New Value with Rolling Technology Develops Insulated Stainless Steel FI (Fine Insulation) Finish

NIPPON KINZOKU CO., LTD. (TOKYO: 5491) (Headquarters: Minato-ku, Tokyo) announced that it has developed the "FI (Fine Insulation) finish", a stainless steel with high surface insulation resistance. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250415148656/en/We have developed our own “FI finish”, a stainless steel surface pre-coated with an inorganic coating (about 1μm in thickness) that offers electrical insulation resistance. In ...